- Immersion copper plating of leads prior to solder dipping in lieu of expensive Au plating.
- MCM technology.
- Microwave fine line capability.
- Glass to metal seals including hermetic optical windows.
- Flux-less soldering below 2% voids.
- Lead free solder technology.
- Analytical Material Analysis.
- Attachment of copper wires to Thick Film PdAg material (QML Process).
- Broad spectrum of lead forming.
- Plugger technology, feed thru holes for enhanced thermal and electrical characteristics.
- Plastic molded ball grid array assemblies.
- Wafer and substrate dicing capability.
- Custom resistor chips with special tailored TCR requirements utilizing thick film material.
- Plated micro grid arrays.
- Aluminum Nitride for high power dissipation in packages.
- Al 2O 3 Refractory capability.
- Aluminum Nitride Refractory capability.
- Mil screened ceramic Opto-Coupler.
- High temperature brazing capability.
- High temperature sealing glass for custom packages.
- Hermetically sealed high voltage and/or current hybrid flat pack style packages.
- Ultra low line resistance ( @ 4 milliohms) for high power packaging requirements.
- Nickel and copper direct bond ceramic plating.
- Ag plating to thick film material.
- Fine line copper circuitry.
- Immersion Au and Cu plating.
- Direct die attach to heat sink.
|
About Us 